Image Acquisition Manufacturing
Our image acquisition solutions deliver high-quality, reliable, and flexible imaging for industrial, scientific, and commercial applications. Supporting wired, wireless, SOC, and USB interfaces, our systems provide precise capture, seamless processing, and stable performance across single or multi-camera setups. With real-time image acquisition, advanced processing options, and versatile integration, our solutions em
Image Acquisition Solutions
- Wired Image Transmission :
High-speed, stable data transfer for industrial monitoring and real-time processing. - Wireless Image Transmission:
Flexible remote streaming for mobile robotics, drones, and field inspection. - SOC Multi：
Interface Imaging – Versatile interfaces with on-chip processing for embedded and high-performance devices. - USB Interface Imaging ：
Plug-and-play connection for labs, portable systems, and testing platforms.
Key Service Advantages
- High-Quality Capture:
Ensure sharp, accurate, and reliable image acquisition across diverse environments. - Multi-Interface Support:
Wired, wireless, SOC, and USB interfaces for flexible deployment. - Real-Time Processing:
Integrated image pre-processing for faster analysis and output.
Synchronization & Triggering:
Precise timing control for single or multi-camera setups. - Software Integration：
SDK and API support for seamless integration with Windows, Linux, and embedded systems. - Scalable Solutions:
From single-camera setups to complex multi-camera networks.
Image acquisition system
- High-Quality Capture & Multi-Scenario Adaptation：Built around “high-quality image acquisition + stable transmission + full-scenario compatibility,” the product portfolio covers industries such as industrial manufacturing, medical, education, vehicle systems, and public security. Core advantages include industrial-grade stability, multi-interface compatibility, customizable solutions, and professional technical support.
- Low Latency & High-Efficiency Transmission：Equipped with PCIe 2.0 ×4 high-speed bus (up to 2 GB/s bandwidth) and 9 KB jumbo frame transmission technology, significantly improving large-image transfer efficiency (e.g., wafer and 3C inspection) by 30%. Latency is reduced to microsecond level, meeting real-time inspection requirements.
- Industrial-Grade Protection for Harsh Environments：Supports a wide operating temperature range of -10°C to +70°C, with 8 kV ESD protection. Fanless and highly shock-resistant design ensures stable operation in high/low temperature, humidity, and strong electromagnetic interference environments, enabling 24/7 continuous performance.
- Multiple Interface & Customizable Solutions：Provides four standardized transmission options: wired image transmission, wireless image transmission, SoC multi-interface, and USB interface, with support for customized development to meet diverse data acquisition and transmission needs
Wireless Image Transmission
- Digital modulation technology:
Principles, symbol rate, and bandwidth calculation of QPSK modulation. The principle of QPSK (Quadrature Phase Shift Keying) modulation: In CATV uplink channels, QPSK is commonly used when interference is strong. QPSK uses two orthogonal carriers, transforming the binary digital signal into two equally divided parallel signals, modulating the phase of each of the two orthogonal carriers, and then adding them together. - Advantages:
High bandwidth, low latency, strong anti-interference, supports long-distance transmission (≤100 meters), suitable for fixed scenarios such as industrial production lines, medical imaging, and security monitoring. - Features:
Compatible with industrial protocols such as Camera Link, GMSL, and MIPI; supports multi-camera synchronous triggering; data integrity verification; meets high-precision acquisition requirements.
Wireless Image Transmission
- Wireless networks:
Use wireless communication to connect networks without cables or fiber, suitable for ports, construction sites, freight yards, and intersections. Compared with wired systems, they offer flexible deployment, easy installation, and lower cost. The LSW series supports 5.8GHz band with point-to-point, point-to-multipoint, and repeater modes. - Cable-free operation:
Enables stable mobile data transmission for drones, vehicle vision systems, and mobile robots. - COFDM technology:
Provides strong anti-interference and anti-obstruction performance, supports 4K@30fps HD transmission, and features low power consumption for longer operating time.
SOC Multi-Interface Image Acquisition Solution
- What is SoC：
A System on Chip (SoC) integrates the core components of an information system into a single chip. In a broad sense, it is a complete micro-system that combines a CPU, memory, and various functional IP cores. It is typically customized or designed for specific applications, integrating microprocessors, analog IP cores, digital IP cores, and memory or external memory interfaces on one chip. - Advanced Chip Integration：
Integrated with mainstream chips such as Sunplus Innovation, Novatek, Anyka, and Microdrive. Built-in ISP (Image Signal Processor) enables hardware-level image optimization including noise reduction, HDR, and color correction. - Multi-Interface & AI Edge Computing：
Supports multiple interfaces including MIPI, LVDS, and HDMI. With AI edge computing capability, it can directly integrate NPU for real-time recognition, reducing backend processing load and improving system efficiency.
Our Solutions
An integrated counter-UAV solution combining detection and precision strike capabilities.
USB Image Acquisition
High-speed image capture via standard USB interfaces for PCs and mobile devices.
SoC Multi-Interface Solution
Integrated SoC design with flexible interfaces for efficient image processing.
Wireless Transmission
Real-time image transfer via wireless networks (AP, bridge, etc.) with high stability.
Wired Transmission
Stable high-speed image capture and processing via MCU-controlled systems.
Ability
We specialize in the development and application of advanced optoelectronic technologies, integrating semiconductor laser chips, sensing systems, and intelligent imaging solutions. Our core capabilities support a wide range of industries including industrial automation, intelligent sensing, aerospace technology, and scientific research.
